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Advanced Packaging
Increasing Options for Design Engineers
Celanese Micromax™ business provides chip designers with multiple advanced packaging solutions. Our integrated suite of printable, dispensable, and jettable inks enables sophisticated treatment of today’s most challenging advanced packaging challenges.
Thermal Management
- Single pass film cured thickness of 30 to 50 μm
- Tunable CTE with high adhesion to a variety of substrates including AlN
- High thermal and electrical conductivity
- Solderable and plateable print surfaces
- Mechanical compatibility with tungsten vias
Die Encapsulants
- Superior environmental resistance
- Excellent thermal and mechanical stress tolerance
- Single pass thickness of 5 μm provides full performance
Die Attach
- Low pressure sintering silver pastes
- High thermal and electrical conductivity
- High productivity thru fast takt
- Broad manufacturing process compatibility
Thermal Via
- Excellent performance in high aspect ratio application
