Advanced Packaging

 
 
 

Increasing Options for Design Engineers

DuPont’s Microcircuit and Component Materials business provides chip designers with multiple advanced packaging solutions. Our integrated suite of printable, dispensable, and jettable inks enables sophisticated treatment of today’s most challenging advanced packaging challenges.

 
 
 
 
 
 

Thermal Management

  • Single pass film cured thickness of 30 to 50 μm
  • Tunable CTE with high adhesion to a variety of substrates including AlN
  • High thermal and electrical conductivity
  • Solderable and plateable print surfaces
  • Mechanical compatibility with tungsten vias 

 

Die Encapsulants

  • Superior environmental resistance
  • Excellent thermal and mechanical stress tolerance
  • Single pass thickness of 5 μm provides full performance

Die Attach

  • Low pressure sintering silver pastes
  • High thermal and electrical conductivity
  • High productivity thru fast takt
  • Broad manufacturing process compatibility 

 

Thermal Via

  • Excellent performance in high aspect ratio application
 
 
 
 
 
 

Collateral Highlights

 
 
 
 
 
 
 
 
 

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