Advanced Packaging


Increasing Options for Design Engineers

Celanese Micromax™ business provides chip designers with multiple advanced packaging solutions. Our integrated suite of printable, dispensable, and jettable inks enables sophisticated treatment of today’s most challenging advanced packaging challenges.


Thermal Management

  • Single pass film cured thickness of 30 to 50 μm
  • Tunable CTE with high adhesion to a variety of substrates including AlN
  • High thermal and electrical conductivity
  • Solderable and plateable print surfaces
  • Mechanical compatibility with tungsten vias 


Die Encapsulants

  • Superior environmental resistance
  • Excellent thermal and mechanical stress tolerance
  • Single pass thickness of 5 μm provides full performance

Die Attach

  • Low pressure sintering silver pastes
  • High thermal and electrical conductivity
  • High productivity thru fast takt
  • Broad manufacturing process compatibility 


Thermal Via

  • Excellent performance in high aspect ratio application

Collateral Highlights


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