Dielectric & Encapsulant Materials for Hybrid Circuits
DuPont offers a complete set of high-performing dielectric materials, suitable for a wide variety of applications.
These materials are designed to deliver the best reliability/performance vs. system level cost, enabling more cost-effective manufacturing processes including fine-line printing, 30 or 60 minute firing profiles, co-fireability and unprecedented field reliability.
Dielectric materials for alumina or aluminum nitride (AlN) substrates from DuPont feature:
- Broad conductor compatibility (gold, silver and alloys) for both cross-over and multilayer systems
- Excellent re-fire stability
- Co-fire compatibility
Encapsulants for alumina substrates from DuPont offer:
- Pb-free and Cd-free systems that require low temperature firing profiles from 550 ◦C to 620 ◦C
- Excellent compatibility with printed resistors delivering very predictable printed resistor shifts