Introduction to Thick Film Technology Seminar


Seminar Agenda & Session Overviews

June 11 - 12, 2019

DAY 1 TUESDAY, JUNE 11, 2019
7:45am Coffee
8:00am Welcome & Introduction to PVAM
Manufacturing and Quality Assurance of DuPont Thick Film Materials 
The thick film composition is broken down into individual components such as metal powder, glass frit, vehicles and solvents. We show how each component is manufactured, types of industrial equipment used, and how they are QC tested and controlled for quality and consistency.
 Conductor Technology & Solderable Conductors
Conductors are used for conductive lines, lead pads, resistor terminations, electrodes for passive components, soldering & brazing. Metallurgies, binder types, and rheology and their impact on conductor functional performance and properties are discussed. There are many conductor compositions available for a variety of different applications.

 Wire Bonding
Gold conductors are typically used when wire bonding is needed, and with high reliability applications. Wire bonding process details with gold and aluminum wires are discussed.

Dielectric Technology
There are four main types of thick film dielectrics; multilayer and crossover, capacitor, and encapsulant dielectrics. Important characteristics and performance properties are critical to insure their proper function. These are examined, as well as the testing methods used to validate them.
Photovoltaic Technology
This is an introduction into PV thick film technology, and includes a discussion about solar applications, processing wafers, performance requirements, and various compositions.
Polymer Thick Film/Printed Electronics
Also known as “conductive inks” or “PTF”, these materials exhibit electrical properties only after having been cured or dried to remove solvent. Applications for these materials include membrane touch switches, RFID tags, biosensors, batteries, fuel cells, wearables, and in-mold applications etc.
Etchable Thick Film & Specialty Technologies 
Technologies are discussed that enable fine feature formation beyond conventional screen printing technology. Fodel®, etching, Diffusion Patterning™ technologies, Laser-structurable materials are covered. Specialty materials for Aluminum, stainless steel, aluminum nitride, and glass are discussed. Lead free products are cited.

Introduction to LTCC
The technology and process of Low Temperature Cofired Ceramics is introduced. Green Tape™ 951, and 9K7 systems are discussed.

Lab Tour 1
Day 1 lab facility tours include the LTCC (Low Temperature Cofired Ceramic) prototyping area, Large format printing and Photovoltaic lab areas.
5:30pm Cocktails and Dinner
7:45am Coffee
Resistor Technology                     
Thick film resistor compositions consist of an electrically conductive phase and an insulating phase. Resistor performance (R, TCR, length effects, power handling, etc) can be influenced by the resistor composition selection. Various processing details are discussed to help insure intended performance.
Furnace and Firing Technology
Firing is a complex process. Various furnace designs are examined. Profiles and airflow details are examined to insure consistent performance or improve yields.

Laser Trimming
Laser trimming is used to adjust individual resistor values. General rules to follow, in addition to the laser trimmer manufacturer guidance will help insure that performance requirements can be met.

Screen Printing Technology, Viscosity & Rheology
There are many details involved with screen printing. “Best practices” are discussed in detail to select the proper screen, mesh, emulsion, squeegee, print speed, printer setup, etc., ultimately to help improve control of thick film deposition. This section provides a thorough understanding of the printing process to enable one to troubleshoot and solve printing problems.

Substrate Interactions
Various thick film compositions are designed and QA tested to be compatible with a specific substrate, whether it is 96% alumina, BeO, AlN, glass, Mylar®, paper, etc. Important characteristics are explained so that the proper compatible materials can be selected.
Multilayer Interconnect Construction
One way to increase circuit density is with multilayer processing of dielectric layers and conductor layers. This process is described in detail and a complete material set is examined.

Very low temp materials & Inkjet
In applications that use sensitive substrates specially modified paste are required to allow ultra-low curing temperatures as low as 60°C to be used.

Lab Tours
Lab facilities are opened to show typical steps involved with thick film manufacturing & processing. Screen printing, soldering, firing, laser trimming, wire bonding, and screen preparation areas are included.

3:30pm - Wrap-up and Adjourn

A DuPont Representative will contact you to confirm your attendance and provide detailed information regarding lodging.


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