Thick Film Materials


Innovative, high-performing thick film materials for flexible, rigid and hybrid substrates

Celanese brings materials science expertise in developing thousands of metallic, polymeric, and glass materials designed to perform specific functions. Customers look to us to apply our extensive knowledge to create innovative, high-quality materials that will perform well no matter how demanding the application.

For product designers and engineers looking to create or specify high performance printed electronic circuits and components on flexible, rigid and hybrid substrates, Celanese offers a comprehensive suite of printed electronics products and services available globally. We have helped customers achieve successful design solutions for a variety of applications in consumer electronics, automotive, aerospace, biotechnology, telecommunications, military, information technology, energy, photovoltaics, and many other industries.

Celanese also offers a high-performance line of low-temperature co-fired ceramic (LTCC) materials to enable high-frequency, high-reliability circuitry for 5G telecom (wireless base stations and smartphones / mobile devices) and military communications applications. In addition, we have the fullest range of high-fire thick-film pastes suitable for high-reliability hybrid circuits as well as a broad range of passive component materials.

Choose Celanese as your materials solutions partner to:

  • Identify the best printed electronic products for your particular application or circuit design
  • Create cost-effective, high-performance, high quality, and scalable printed circuit designs on flexible or rigid substrates
  • Access our global team that can support your design and manufacturing value chain, wherever they are located
  • Deliver quality solutions quickly and meet your industry’s fast design cycles



Celanese extensive thick film product line provides maximum design flexibility in terms of substrate compatibility: ranging from low temperature curable pastes suitable for PVC, polyethylene, polypropylene and PET substrates, to high performance pastes that can perform up to 250°C on high-temperature flexible substrates like PEN and DuPont™ Kapton™ polyimide films. Our materials are also compatible with other polymer, glass, metal and ceramic substrates.


Product families

The category of thick film materials includes a variety of functional inks and pastes used to manufacture electronic circuits. These materials are typically deposited by printing and are between 10 and 20 µm thick.


Thick film materials appear in electronics designed to support a wide range of industry sectors including consumer electronics, automotive, internet of things, telecom, biomedical, space, and military. Continuing advances in electronics require innovative functional materials to create smaller, thinner, more flexible products.


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